Next message: Richard Goodwin: "Re: lv-ab: Designing for failure"
> I agree with Norm that quite often heat is a major cause of
> failure in electronic components.
Yes it is, and a worse problem is one I have seen many times in my years
with the computer industry: companies will often use the smallest part
they can for a particular application, and depend on heat sinks to keep
it cool, so that they can save a few pennies on each production unit.
They make these margins of error so small at times, that if the designer
was off even a little in estimatine the power a device has to dissipate,
or the efficiency of a heat sink, or the amount of cooling available to
remove heat from the heat sink, then the device will overheat and
eventually fail because of it. It has always seemed like a false
economy to me, but that's they way they like to do it. I suspect an MBA
behind the curtain somewhere. :-)
Dick
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